Moseley Technical Services, Inc.

Chelmsford, Massachusetts

Posted in Recruitment Consultancy

This job has expired.

Job Info

Check out this new opportunity!


Chelmsford, MA

Contract Position

At Moseley we are supporting the largest defense contractors Missile and Fire Control program. The efforts of our employees are the key to the newest innovations in defense and aerospace.

We invite you to join our team supporting the most mission critical programs across the globe!


  • Perform fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies.
  • Perform gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals and other microelectronic components.
  • Wirebonding onto small pad sizes down to 0.001" in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
  • Troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement.
  • Installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies.
  • Utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications.
  • Plan work sequence by assessing work in progress to schedule requirements.
  • Collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.
  • High School Diploma required
  • Interim Secret Clerance; Secret Clearance preferred.
  • Experience in wirebonding and ribbon bonding (0.001" and 0.0007" wire and various sizes of ribbon)
  • Ability to work 10 hours under a microscope and utilize hand tools such torque drivers, tweezers and other similar tools
  • Good dexterity and eye/hand coordination
  • Experience in microelectronics assembly (chip and wire assembly)
  • Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
  • Ability to work in a diverse team environment; Good interpersonal, teaming and communication skills
  • Active secret clearance preferred, willing to consider candidates with a previously held active clearance. Interim secret clearance required to start position. (must be included on resume)
  • Desired Skills:
    • Experience in hybrid assembly in accordance with Mil STD 883
    • Experience wirebonding or ribbon bonding to ceramic or duroid substrates
    • Experience using Westbond and Metcal bonding machines and Unitech welder.
    • Experience in substrate and component attach, auto pick-and-place
    • Experience operating auto or manual bonding equipment
    • Familiarity working in an ESD and FOD controlled environment
    • Experience in mechanical assembly processes of small electronic devices
    • Experience working on military products in ISO 9001 / AS9100 controlled environments

Your Recruiter

Still have questions? Reach out to

Cindy- (phone) (256) 635-2691 (email)

What to Expect

  • Applicants selected for employment will be required to pass a pre-employment drug screening and background investigation which may include education, criminal and work history verifications.
  • Accepted applicants will have the opportunity to be eligible for benefits, including medical and supplemental insurance and a 401K. Appreciation and gratitude for employees is a hallmark of organizations with low turnover.

Moseley Technical Services, Inc. is an AA/EEO/Veterans/Disabled Employer.


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For more information about Moseley visit:

This job has expired.

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